XCVC1502-2LSENSVG1369
IC VERSAL AI-CORE FPGA 1369BGA
XCVC1502-2LSENSVG1369 Specifications
Architecture:
MPU, FPGA
Operating Temperature:
0°C ~ 100°C (TJ)
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core Processor:
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Peripherals:
DDR, DMA, PCIe
Speed:
450MHz, 1.08GHz
Number of I/O:
500
Package / Case:
1369-BFBGA, FCBGA
Supplier Device Package:
1369-FCBGA (35x35)
Primary Attributes:
Versal™ AI Core FPGA, 800k Logic Cells