XCVM1302-1LSINSVF1369
IC VERSALPRIME ACAP FPGA 1369BGA
XCVM1302-1LSINSVF1369 Specifications
Architecture：
MPU, FPGA
Operating Temperature：
-40°C ~ 100°C (TJ)
Connectivity：
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core Processor：
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Peripherals：
DDR, DMA, PCIe
Speed：
400MHz, 1GHz
Primary Attributes：
Versal™ Prime FPGA, 70k Logic Cells
Package / Case：
1369-BFBGA
Supplier Device Package：
1369-BGA (35x35)
Number of I/O：
316
