XCVM1302-2LLEVSVD1760
IC VERSALPRIME ACAP FPGA 1760BGA
XCVM1302-2LLEVSVD1760 Specifications
Architecture：
MPU, FPGA
Operating Temperature：
0°C ~ 100°C (TJ)
Connectivity：
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core Processor：
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Peripherals：
DDR, DMA, PCIe
Speed：
450MHz, 1.08GHz
Package / Case：
1760-BFBGA, FCBGA
Supplier Device Package：
1760-FCBGA (40x40)
Primary Attributes：
Versal™ Prime FPGA, 70k Logic Cells
Number of I/O：
402
